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Motorola Integrated Circuits

Founded in 1928 as Galvin Manufacturing, Motorola, as it became known soon after, was a top manufacturer of radio technology before entering the semiconductor industry. Motorola has been a main supplier of microprocessors used in Commodore Amiga, Apple Macintosh, and Power Macintosh personal computers. In the 1990s, Motorola developed the PowerPC family processors in partnership with IBM and Apple. In 2004, Motorola spun off its semiconductor product sector into a separate company called Freescale Semiconductor, which remains the global leader in semiconductors for automotive applications and second largest producer of embedded microprocessors.

Complete Die Photomicrographs
MC 68020

Small Die (95k) | Medium Die (174k) | Large Die (242k)

MC 68040

Small Die (102k) | Medium Die (186k) | Large Die (245k)

MC 88110

Small Die (86k) | Medium Die (164k) | Large Die (232k)

PowerPC 601

Small Die (98k) | Medium Die (189k) | Large Die (265k)

PowerPC 602

Small Die (79k) | Medium Die (151k) | Large Die (245k)

PowerPC 603

Small Die (16k) | Medium Die (30k) | Large Die (52k)

PowerPC 604

Small Die (48k) | Medium Die (92k) | Large Die (265k)

PowerPC 620

Small Die (84k) | Medium Die (167k) | Large Die (273k)

High Magnification Images

PowerPC 601 (75K) - Partial die shot of the IBM/Motorola PowerPC 601 microprocessor showing rows of C-4 solder spheres interwoven with thousands of bus connections using oblique illumination with red and green gels.

PowerPC 601 (64K) - Partial die shot of five of the C-4 solder spheres seemingly interconnected by a microscopic highway using oblique illumination with green and red gels.

PowerPC 601 (67K) - Partial die shot of the IBM/Motorola PowerPC 601 showing eight of the C-4 solder spheres and many bus connections on the chip using oblique illumination with red and green gels.

PowerPC 601 (61K) - Partial die shot of the IBM/Motorola PowerPC 601 microprocessor showing three C-4 solder spheres on a printed circuit board using oblique illumination with green and red gels.

PowerPC 601 (79K) - Partial die shot of the IBM/Motorola PowerPC 601 microprocessor showing rows of C-4 solder spheres and bus connections using oblique illumination with red and green gels.

PowerPC 601 (58K) - Partial die shot of the IBM/Motorola PowerPC 601 microprocessor showing thirteen C-4 solder spheres and connections using oblique illumination with red and green gels.

PowerPC 601 (71K) - Partial die shot of the IBM/Motorola PowerPC 601 microprocessor showing C-4 solder spheres and the printed circuit board connections using oblique illumination with red and green gels.

PowerPC 601 (66K) - Partial die shot of the IBM/Motorola PowerPC 601 microprocessor showing the printed circuit board connections and the C-4 solder spheres using oblique illumination with red and green gels.

PowerPC 601 (54K) - Partial die shot of the IBM/Motorola PowerPC 601 microprocessor showing an uncluttered grid of C-4 solder spheres and PCB connections using oblique illumination with green and red gels.

PowerPC 602 (53K) - Partial die shot of the IBM/Motorola PowerPC 602 microprocessor showing the thousands of bus connections on the chip using oblique illumination with red, green, and yellow gels.

PowerPC 602 (55K) - Partial die shot of the IBM/Motorola PowerPC 602 wafer showing a scribe line intersection and chip bus connections using oblique illumination with red, green, and yellow gels.

PowerPC 603 (58K) - Partial die shot of the IBM/Motorola PowerPC 603 microprocessor showing the bus connections on the body of the chip using oblique illumination with red and blue gels.

PowerPC 603 (50K) - Partial die shot of the IBM/Motorola PowerPC 603 microprocessor showing the die pad, bonding points, and bus connections using oblique illumination with red and green gels.

PowerPC 603 (59K) - Partial die shot of the IBM/Motorola PowerPC 603 wafer showing a scribe intersection and chip bus connections using oblique illumination with red and yellow gels.

PowerPC 604 (63K) - Partial die shot of the IBM/Motorola PowerPC 604 microprocessor showing the surrounding pad and C-4 solder spheres using oblique illumination with red and blue gels.

PowerPC 604 (69K) - Partial die shot of the IBM/Motorola PowerPC 604 microprocessor showing the C-4 solder spheres and bus connections using oblique illumination with red and blue gels.

PowerPC 604 (68K) - Partial die shot of the IBM/Motorola PowerPC 604 microprocessor showing a grid of hundreds of C-4 solder spheres using oblique illumination with blue, red, and yellow gels.

PowerPC 604 (63K) - Partial die shot of the IBM/Motorola PowerPC 604 microprocessor showing many C-4 solder spheres using oblique illumination with yellow, red, and blue gels.

PowerPC 620 (64K) - Partial die shot of the IBM/Motorola PowerPC 620 microprocessor showing the hundreds of C-4 solder spheres on this inverted chip using oblique illumination with green and red gels.

PowerPC 620 (64K) - Partial die shot of the IBM/Motorola PowerPC 620 microprocessor showing hundreds of C-4 solder spheres and bus connections using oblique illumination with red and green gels.

PowerPC 620 (70K) - Partial die shot of the IBM/Motorola PowerPC 620 microprocessor showing a large grid of the C-4 solder spheres using oblique illumination with green gels.

PowerPC 620 (65K) - Partial die shot of the IBM/Motorola PowerPC 620 microprocessor showing C-4 solder spheres and bus connections using oblique illumination with red, green, and yellow gels.

PowerPC 620 (63K) - Partial die shot of the IBM/Motorola PowerPC 620 microprocessor showing a large number of C-4 solder spheres and bus connections using oblique illumination with red and green gels.

PowerPC 620 (65K) - Partial die shot of the IBM/Motorola PowerPC 620 microprocessor showing C-4 solder spheres and bus connections using oblique illumination with green and red gels.

PowerPC 620 (62K) - Partial die shot of the IBM/Motorola PowerPC 620 microprocessor showing C-4 solder spheres using oblique illumination with red and green gels.

PowerPC 620 (61K) - Partial die shot of the IBM/Motorola PowerPC 620 microprocessor showing two grids of C-4 solder spheres and bus connections using oblique illumination with red, yellow, and green gels.

PowerPC 620 (60K) - Partial die shot of the IBM/Motorola PowerPC 620 microprocessor showing a grid of C-4 solder spheres using oblique illumination with green, red, and yellow gels.

PowerPC 620 (67K) - Partial die shot of the IBM/Motorola PowerPC 620 microprocessor showing hundreds of C-4 solder spheres on the printed circuit board using oblique illumination with green, red, and yellow gels.

PowerPC 620 (68K) - Partial die shot of the IBM/Motorola PowerPC 620 microprocessor showing five grids of C-4 solder spheres and bus connections using oblique illumination with red and green gels.

PowerPC 620 (69K) - Partial die shot of the IBM/Motorola PowerPC 620 microprocessor showing many C-4 solder spheres on the printed circuit board using oblique illumination with red, yellow, and green gels.

PowerPC 620 (65K) - Partial die shot of the IBM/Motorola PowerPC 620 microprocessor showing both a grid and checkerboard arrangement of C-4 solder spheres using oblique illumination with blue, red, and yellow gels.

PowerPC 620 (70K) - Partial die shot of the IBM/Motorola PowerPC 620 microprocessor showing multiple grids of C-4 solder spheres and bus connections using oblique illumination with green, red, and yellow gels.

PowerPC 620 (64K) - Partial die shot of the IBM/Motorola PowerPC 620 microprocessor showing four grids of C-4 solder spheres on the printed circuit board using oblique illumination with red, yellow, and green gels.

PowerPC 620 (66K) - Partial die shot of the IBM/Motorola PowerPC 620 microprocessor giving an uncluttered view of both a grid and checkerboard arrangement of C-4 solder spheres using oblique illumination with red, yellow, and green gels.


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