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With more than 330,000 employees worldwide and revenues of $96 billion (figures from 2004), International Business Machines Corp. (IBM) is the largest information technology company in the world and one of the few with a continuous history dating back to the nineteenth century. IBM fields engineers and consultants in more than 170 countries. It is a pioneer in all segments of computer science and information technology, ranging from supercomputers to nanotechnology.

Complete Die Photomicrographs
Digital Signal Processor

Small Die (114k) | Medium Die (216k) | Large Die (312k)

Blue Lightning

Small Die (124k) | Medium Die (229k) | Large Die (317k)

486 SLC2

Small Die (103k) | Medium Die (189k) | Large Die (256k)

RS/6000 (fpu chip)

Small Die (97k) | Medium Die (187k) | Large Die (254k)

PowerPC 601

Small Die (98k) | Medium Die (189k) | Large Die (265k)

PowerPC 602

Small Die (79k) | Medium Die (151k) | Large Die (245k)

PowerPC 603

Small Die (48k) | Medium Die (92k) | Large Die (165k)

PowerPC 604

Small Die (76k) | Medium Die (147k) | Large Die (217k)

PowerPC 620

Small Die (84k) | Medium Die (167k) | Large Die (273k)

High Magnification Images

486 SLC (51K) - Partial die shot of the IBM 486 SLC wafer showing the joint between the intersection of two scribe lines using oblique illumination with red, blue, and yellow gels.

486 SLC (48K) - Partial die shot of the IBM 486 SLC wafer showing the bonding points and scribe line intersection using oblique illumination with red, blue, and yellow gels.

486 SLC (52K) - Partial die shot of the IBM 486 SLC wafer showing the bonding points and bus connections on the chip and scribe line intersection on the wafer using oblique illumination with red, blue, and yellow gels.

486 SLC2 (62K) - Partial die shot of the IBM 486 SLC2 wafer showing the bonding points for the bonding wires and the many bus connections running from them using oblique illumination with red, blue, and yellow gels.

486 SLC2 (57K) - Partial die shot of the IBM 486 SLC2 wafer using oblique illumination with blue, red, and yellow gels to show a scribe line, bus connections, and bonding points.

486 SLC2 (56K) - Partial die shot of the IBM 486 SLC2 wafer showing the bonding points and bus connections from one of the chips using oblique illumination with red, blue, and yellow gels.

Blue Lightning (71K) - Partial die shot of the IBM Blue Lightning microprocessor showing hundreds of bus connections using oblique illumination with green and red gels.

Blue Lightning (71K) - Partial die shot of the IBM Blue Lightning microprocessor showing the bonding points and bus connections using oblique illumination with blue, red, and yellow gels.

DAC Wafer (71K) - Partial die shot of the IBM DAC wafer showing a scribe line intersection and many C-4 solder spheres on the chips using oblique illumination with blue and red gels.

R-6000 (69K) - Partial die shot of the IBM R-6000 FPU showing the C-4 solder spheres and bus connections on the chip using oblique illumination with red, blue, and yellow gels.

PowerPC 601 (75K) - Partial die shot of the IBM/Motorola PowerPC 601 microprocessor showing rows of C-4 solder spheres interwoven with thousands of bus connections using oblique illumination with red and green gels.

PowerPC 601 (64K) - Partial die shot of five of the C-4 solder spheres seemingly interconnected by a microscopic highway using oblique illumination with green and red gels.

PowerPC 601 (67K) - Partial die shot of the IBM/Motorola PowerPC 601 showing eight of the C-4 solder spheres and many bus connections on the chip using oblique illumination with red and green gels.

PowerPC 601 (61K) - Partial die shot of the IBM/Motorola PowerPC 601 microprocessor showing three C-4 solder spheres on a printed circuit board using oblique illumination with green and red gels.

PowerPC 601 (79K) - Partial die shot of the IBM/Motorola PowerPC 601 microprocessor showing rows of C-4 solder spheres and bus connections using oblique illumination with red and green gels.

PowerPC 601 (58K) - Partial die shot of the IBM/Motorola PowerPC 601 microprocessor showing thirteen C-4 solder spheres and connections using oblique illumination with red and green gels.

PowerPC 601 (71K) - Partial die shot of the IBM/Motorola PowerPC 601 microprocessor showing C-4 solder spheres and the printed circuit board connections using oblique illumination with red and green gels.

PowerPC 601 (66K) - Partial die shot of the IBM/Motorola PowerPC 601 microprocessor showing the printed circuit board connections and the C-4 solder spheres using oblique illumination with red and green gels.

PowerPC 601 (54K) - Partial die shot of the IBM/Motorola PowerPC 601 microprocessor showing an uncluttered grid of C-4 solder spheres and PCB connections using oblique illumination with green and red gels.

PowerPC 602 (53K) - Partial die shot of the IBM/Motorola PowerPC 602 microprocessor showing the thousands of bus connections on the chip using oblique illumination with red, green, and yellow gels.

PowerPC 602 (55K) - Partial die shot of the IBM/Motorola PowerPC 602 wafer showing a scribe line intersection and chip bus connections using oblique illumination with red, green, and yellow gels.

PowerPC 603 (58K) - Partial die shot of the IBM/Motorola PowerPC 603 microprocessor showing the bus connections on the body of the chip using oblique illumination with red and blue gels.

PowerPC 603 (50K) - Partial die shot of the IBM/Motorola PowerPC 603 microprocessor showing the die pad, bonding points, and bus connections using oblique illumination with red and green gels.

PowerPC 603 (59K) - Partial die shot of the IBM/Motorola PowerPC 603 wafer showing a scribe intersection and chip bus connections using oblique illumination with red and yellow gels.

PowerPC 604 (63K) - Partial die shot of the IBM/Motorola PowerPC 604 microprocessor showing the surrounding pad and C-4 solder spheres using oblique illumination with red and blue gels.

PowerPC 604 (69K) - Partial die shot of the IBM/Motorola PowerPC 604 microprocessor showing the C-4 solder spheres and bus connections using oblique illumination with red and blue gels.

PowerPC 604 (68K) - Partial die shot of the IBM/Motorola PowerPC 604 microprocessor showing a grid of hundreds of C-4 solder spheres using oblique illumination with blue, red, and yellow gels.

PowerPC 604 (63K) - Partial die shot of the IBM/Motorola PowerPC 604 microprocessor showing many C-4 solder spheres using oblique illumination with yellow, red, and blue gels.

PowerPC 620 (64K) - Partial die shot of the IBM/Motorola PowerPC 620 microprocessor showing the hundreds of C-4 solder spheres on this inverted chip using oblique illumination with green and red gels.

PowerPC 620 (64K) - Partial die shot of the IBM/Motorola PowerPC 620 microprocessor showing hundreds of C-4 solder spheres and bus connections using oblique illumination with red and green gels.

PowerPC 620 (70K) - Partial die shot of the IBM/Motorola PowerPC 620 microprocessor showing a large grid of the C-4 solder spheres using oblique illumination with green gels.

PowerPC 620 (65K) - Partial die shot of the IBM/Motorola PowerPC 620 microprocessor showing C-4 solder spheres and bus connections using oblique illumination with red, green, and yellow gels.

PowerPC 620 (63K) - Partial die shot of the IBM/Motorola PowerPC 620 microprocessor showing a large number of C-4 solder spheres and bus connections using oblique illumination with red and green gels.

PowerPC 620 (65K) - Partial die shot of the IBM/Motorola PowerPC 620 microprocessor showing C-4 solder spheres and bus connections using oblique illumination with green and red gels.

PowerPC 620 (62K) - Partial die shot of the IBM/Motorola PowerPC 620 microprocessor showing C-4 solder spheres using oblique illumination with red and green gels.

PowerPC 620 (61K) - Partial die shot of the IBM/Motorola PowerPC 620 microprocessor showing two grids of C-4 solder spheres and bus connections using oblique illumination with red, yellow, and green gels.

PowerPC 620 (60K) - Partial die shot of the IBM/Motorola PowerPC 620 microprocessor showing a grid of C-4 solder spheres using oblique illumination with green, red, and yellow gels.

PowerPC 620 (67K) - Partial die shot of the IBM/Motorola PowerPC 620 microprocessor showing hundreds of C-4 solder spheres on the printed circuit board using oblique illumination with green, red, and yellow gels.

PowerPC 620 (68K) - Partial die shot of the IBM/Motorola PowerPC 620 microprocessor showing five grids of C-4 solder spheres and bus connections using oblique illumination with red and green gels.

PowerPC 620 (69K) - Partial die shot of the IBM/Motorola PowerPC 620 microprocessor showing many C-4 solder spheres on the printed circuit board using oblique illumination with red, yellow, and green gels.

PowerPC 620 (65K) - Partial die shot of the IBM/Motorola PowerPC 620 microprocessor showing both a grid and checkerboard arrangement of C-4 solder spheres using oblique illumination with blue, red, and yellow gels.

PowerPC 620 (70K) - Partial die shot of the IBM/Motorola PowerPC 620 microprocessor showing multiple grids of C-4 solder spheres and bus connections using oblique illumination with green, red, and yellow gels.

PowerPC 620 (64K) - Partial die shot of the IBM/Motorola PowerPC 620 microprocessor showing four grids of C-4 solder spheres on the printed circuit board using oblique illumination with red, yellow, and green gels.

PowerPC 620 (66K) - Partial die shot of the IBM/Motorola PowerPC 620 microprocessor giving an uncluttered view of both a grid and checkerboard arrangement of C-4 solder spheres using oblique illumination with red, yellow, and green gels.

IBM RAM


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